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FRP SMC Waffle Board

SMC waffle board is a sheet molding compound (SMC) using unsaturated polyester resin as the matrix and glass fiber as the reinforcing material, formed by high-temperature and high-pressure molding. Its waffle honeycomb structure endows it with characteristics of light weight, high strength, precise dimensions, and a smooth surface, along with excellent corrosion resistance and insulation. It is widely applied in semiconductor cleanrooms, high-end electronics manufacturing workshops, and other fields with strict requirements for cleanliness and flatness.

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  • SMC Waffle Board Introduction

    SMC waffle board is a sheet molding compound (SMC) using unsaturated polyester resin as the matrix and glass fiber as the reinforcing material, formed by high-temperature and high-pressure molding. Its waffle honeycomb structure endows it with characteristics of light weight, high strength, precise dimensions, and a smooth surface, along with excellent corrosion resistance and insulation. It is widely applied in semiconductor cleanrooms, high-end electronics manufacturing workshops, and other fields with strict requirements for cleanliness and flatness.

    Production Process

    1.Raw Material Preparation

    Mix unsaturated polyester resin, glass fiber, fillers and other additives according to the ratio, stir and impregnate with special equipment to make SMC sheets. Strictly control temperature, humidity and mixing time to stabilize material properties.

    2.Cutting and Pre-forming

    Cut SMC sheets into specified sizes, place them into molds for pre-forming to determine the initial shape of the board.

    3.Compression Molding

    Put pre-formed sheets into high-precision molds, cure and crosslink at 120℃-150℃ and 10-20MPa. After holding pressure, high-strength and high-precision waffle boards are formed.

    4.Post-treatment

    Trim edges and polish the surface after demolding to remove burrs. Surface coating can be applied when necessary to enhance protective performance.

    Product Characteristics

    1.High Strength and Lightweight

    The unique waffle honeycomb structure ensures the board maintains high strength while weighing only 1/3 to 1/5 of traditional concrete boards. This effectively reduces the load on building structures and lowers transportation and installation costs.

    2.High Precision and Flatness

    Formed by high-precision mold compression molding, the board features precise dimensions and a flatness of ±1mm/m². This meets the strict flatness requirements of high-end manufacturing industries like semiconductors, ensuring stable operation of precision equipment.

    3.Excellent Corrosion Resistance

    SMC material shows good tolerance to chemicals such as acids, alkalis, and salts, enabling long-term use in humid and corrosive environments. It is resistant to aging and deformation, with a service life of over 30 years.

    4.Superior Insulation Performance

    With excellent electrical insulation, the board has a surface resistivity ≥1×10¹²Ω and volume resistivity ≥1×10¹³Ω・cm. It effectively prevents static electricity accumulation, avoiding damage to electronic components and ensuring production safety.

    5.Good Flame Retardancy

    With an Oxygen Index (OI) ≥30%, it meets the standards for flame-retardant materials. It is difficult to ignite and can effectively prevent fire spread, providing reliable fire safety for industrial production.

    6.Low Dust Emission

    The board’s smooth and dense surface is less prone to dust adsorption. In cleanrooms, its dust emission is extremely low, complying with standards like ISO 14644-1 to maintain high cleanliness in the production environment.

    Product Specifications 

    Classification Common Specifications Optional Range
    Board Thickness 20mm, 25mm, 30mm, 40mm, 50mm 15 - 80 mm
    Single Board Size 1200mm×2400mm, 1500mm×3000mm Length ≤ 6000 mm, Width ≤ 3000 mm
    Waffle Hole Specifications Side length: 150mm×150mm, 200mm×200mm, 300mm×300mm Side length: 100 - 500 mm; Depth customized based on thickness

    ​Product Parameters

    Parameter Category Parameter Index
    Density 1.8 - 2.0 g/cm³
    Flexural Strength ≥ 180 MPa
    Tensile Strength ≥ 120 MPa
    Compressive Strength ≥ 200 MPa
    Water Absorption Rate ≤ 0.2%
    Heat Deflection Temperature ≥ 200℃
    Surface Roughness (Ra) ≤ 0.8μm

    Application Scenarios

    Semiconductor & Electronics Industry:Applied to ceilings, floors and walls of cleanrooms for wafer manufacturing, chip packaging, etc., providing high-precision clean environments to prevent static electricity and dust interference, ensuring product yield.

    Biopharmaceutical Industry:Suitable for sterile workshops and laboratories, compliant with GMP standards. Its corrosion resistance and easy-cleaning features facilitate disinfection and maintenance, safeguarding pharmaceutical production safety.

    Aerospace Manufacturing:Used in component workshops, its high-strength and lightweight properties reduce structural loads, while excellent insulation and flame retardancy ensure reliable production of precision aerospace equipment.

    High-End Laboratories:Applicable as test benches, ceilings, etc., meeting corrosion resistance, insulation, fire protection and cleanliness requirements of physical/chemical/biological labs.

    Food & Beverage Processing:Compliant with hygiene standards, the smooth surface resists bacterial growth and enables easy cleaning, preventing cross-contamination and ensuring food safety.

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